Online medium and large size automatic bonding production line
Product description:
This production line is mainly used for the cleaning + bonding process in the manufacturing process of automotive/electronic paper/industrial screens and other displays.
The production line consists of plasma cleaning machine + automatic FOG (compatible with FOF) bonding machine + automatic FOB bonding machine, which can complete terminal cleaning, FPC bonding, and PCB bonding processes in the module segment process. It has the characteristics of high temperature and pressure control accuracy, high stability of bonding accuracy, automatic loading and unloading, visual positioning/alignment/detection, code scanning, and CIM functions.
